| Customization: | Available |
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| Type: | Flux-cored Wire |
| Material: | Copper / Copper Alloy |
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Our Sn62Pb36Ag2 is a type of mid temperature tin lead solder paste. It means that the alloy is formed by the 62% tin content, the 36% lead content, and the 2% silver content. Its working temperature can be classified as the preheat temperature from 90ºC to 150ºC, the melting temperature of 183ºC, and the reflow temperature from 190ºC to 100ºC. Therefore, this product is suitable for the highly demanding reflow-soldering work.
The Sn62Pb36Ag2 solder paste is one of the leaded products developed by our company. It conforms to the surface mount technology within the electronics industry. Our product has been exported to Canada, Lithuania, Kazakhstan, Colombia, Argentina, and other countries. Furthermore, we are seeking agents on a global scale. Welcome to contact us, if you are interested in our product.
Scope of Application
This Sn62Pb36Ag2 mid-temperature leaded solder paste is ideal for use in the PCB, SMT, LED circuit boards, various lighting fixtures, computer motherboards, phone motherboards, and a variety of precise circuit boards.
| Specification | Sn62Pb36Ag2 |
| Appearance | Adhesive paste in grayish black |
| Weight | 500g/bottle, 10kg/box |
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