SMT Glue 200g Tube Epoxy Red Glue Adhesive for PCB BGA Solder Pastar

Product Description

  High Quility 200g Adhesive Glue, SMT Red Glue, PCB Red Sealant
SMT red glue is a kind of polyene organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150ºC, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.

 1.High heat-resistivity and excellent electric properties are possessed.

 2.Usable for screen printing.

is a kind of single epoxy resin adhesive .Good stable curing shapes without stringing, overflowing and slumping are achieved even at a super high speed and long time printing. Because of the "rarely cutting" bonding strength and very low humidity absorption, it is specially fit for SMT technology of porous printing in common temperature. Its shape can easily be controlled .We can not only expect a long-term preservation stability but also the excellent thermal resistance and electrical properties.  

 

Feature:

1. if hose at the point of dispensing by adding the amount of the plunger can be more stable; 
2.  because the relationship to prevent drawing the most suitable dispensing set temperature is 30 °C ~ 38 °C; 
3.  fill in the hose from the cylinder, the Please use the private automatic filling machine, in order to prevent infiltration of air bubbles;
4. for the point of washing hose using DBE or ethyl acetate.
5. Packing:100ML/pc;300ML/pc;50pcs/ctn

 

Specifications before curing

Item	Testing condition	Properties
Composition	-	Epoxy resin
Appearance	Visual inspection	Red color gel
Homogeneity	25ºC, fineness meter	< 100μm
Gravity	25ºC	1.25 g/cm³
Viscosity	25ºC, 5rpm	450,000cps
Trixtropy Index	1rpm/10rpm	6.7
Yield Value	25ºC, Haak RV1 Cone plate rheometer, PK100,PK1/1o	300~650Pa
CASSON Viscosity	Same as above	0.15~1.8PaS
Application process	-	Screen printing, dispensing machine

 

Recommended curing condition
The recommended curing condition is 90~120 sec after surface temperature has reached 150ºC, or 160~180 sec after surface temperature has reached 120ºC. The highest curing temperature should not exceed 200 ºC. The ideal curing condition depends on the curing furnace. With a higher curing temperature and longer curing time, the stronger the adhesive strength. The typical curing curve of red glue is as follows:

Specifications after curing

Item			Testing condition	Properties
Adhesive property	Lap shear strength		25ºC,steel - steel	>15MPa Mpa
	Thrust		25ºC, C1206-FR4 copper plate	>40 N
Tg			TMA	80ºC
Adhesive spot diameter growth in curing			SJ/T 11187-1998	< 10%
thermal expansion coefficient		α1	TMA	60×10 -6 K -1
		α2		120×10 -6 K -1
Volume resistance			25ºC	2.2×1015 Ω·cm
Surface resistance			25ºC	2.2×1015 Ω
Dielectric strength			25ºC	25 KV/mm
Dielectric constant			25ºC, 1MHz	3.2
Dielectric loss angle tangent			25ºC, 1MHz	< 0.02

Curing conditions
Absent the presence of special instructions, the curing condition will be 150 ºC for 30 min. The actual adhesive strength of red glue largely depends on the type of component, shape of the glue point, and the curing degree of the glue.

How to use SMT red glue

• With the one-off syringe packing type, it can be used on normal dot dispensers.
• The red glue should be preserved in a refrigerator maintain quality. Before processing, it should be taken out from the refrigerator and placed down vertically for de-freezing in room temperature (ideal temperature for 20~25ºC) about 2~4 hours until it reaching the room temperature. Hot water, oven, hot plate, heat gun and other heat sources should not be used to speed up de-freezing. This step is extremely important for obtaining optimal dot dispensing performance.
• There might be a few interspaces between the needle and its protective cover, which is a normal phenomenon during production. Before use, take the protective cover down and squeeze out a small amount of glue manually to empty the air in the front end.
• To avoid cross contamination of glues, the dot dispenser must be cleaned before equipping it with a syringe.
• The amount of dot dispensing depends on pressure, time, needle diameter and glue temperature. The above parameters should be gradually optimized according to the actual situation.
• Before curing, it can be cleaned by isopropyl alcohol solvent, acetone solvent, butanone solvent and esters solvent. After curing, it can be cleaned only by heating and mechanical removal.

 

Product Description

Company Profile

Established in 2006, Kinggui Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. Our products are widely applied in the soldering of electronic components. Our company has obtained both ISO9001:2000 and ISO9001:2008 certificates. Plenty of our eco-friendly products have passed SGS, RoHS, and other certification.
 

 

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