SMT Glue 200g Tube Epoxy Red Glue Adhesive for PCB BGA Solder Pastar
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| Customization: | Available |
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| Type: | Flux-cored Wire |
| Material: | Copper / Copper Alloy |
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Basic Info.
- Model NO.
- Red Glue
- Flux Containing
- Containing Flux
- Slag Characteristic
- Acidic
- Extended Length
- >20mm
- Appearance
- Lucent, No Dirt on Surface
- Gross Weight of Solder Wire
- 200g/Roll
- Dimension of Solder Bar
- 32cm×1.8cm×1.5cm×0.7kg/PC
- Composition
- Epoxy Resin
- Transport Package
- Carton
- Specification
- Red color gel
- Trademark
- OEM&ODM
- Origin
- China
Packaging & Delivery
- Package Size
- 32.00cm * 1.80cm * 1.50cm
- Package Gross Weight
- 0.200kg
Product Description
High Quility 200g Adhesive Glue, SMT Red Glue, PCB Red Sealant
SMT red glue is a kind of polyene organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150ºC, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing SMT series during wave soldering processes.
1.High heat-resistivity and excellent electric properties are possessed.
2.Usable for screen printing.
is a kind of single epoxy resin adhesive .Good stable curing shapes without stringing, overflowing and slumping are achieved even at a super high speed and long time printing. Because of the "rarely cutting" bonding strength and very low humidity absorption, it is specially fit for SMT technology of porous printing in common temperature. Its shape can easily be controlled .We can not only expect a long-term preservation stability but also the excellent thermal resistance and electrical properties.
Feature:
- if hose at the point of dispensing by adding the amount of the plunger can be more stable;
- because the relationship to prevent drawing the most suitable dispensing set temperature is 30 °C ~ 38 °C;
- fill in the hose from the cylinder, the Please use the private automatic filling machine, in order to prevent infiltration of air bubbles;
- for the point of washing hose using DBE or ethyl acetate.
- Packing:100ML/pc;300ML/pc;50pcs/ctn
| Item | Testing condition | Properties |
| Composition | - | Epoxy resin |
| Appearance | Visual inspection | Red color gel |
| Homogeneity | 25ºC, fineness meter | < 100μm |
| Gravity | 25ºC | 1.25 g/cm³ |
| Viscosity | 25ºC, 5rpm | 450,000cps |
| Trixtropy Index | 1rpm/10rpm | 6.7 |
| Yield Value | 25ºC, Haak RV1 Cone plate rheometer, PK100,PK1/1o | 300~650Pa |
| CASSON Viscosity | Same as above | 0.15~1.8PaS |
| Application process | - | Screen printing, dispensing machine |
Recommended curing condition
The recommended curing condition is 90~120 sec after surface temperature has reached 150ºC, or 160~180 sec after surface temperature has reached 120ºC. The highest curing temperature should not exceed 200 ºC. The ideal curing condition depends on the curing furnace. With a higher curing temperature and longer curing time, the stronger the adhesive strength. The typical curing curve of red glue is as follows:
| Item | Testing condition | Properties | ||
| Adhesive property | Lap shear strength | 25ºC,steel - steel | >15MPa Mpa | |
| Thrust | 25ºC, C1206-FR4 copper plate | >40 N | ||
| Tg | TMA | 80ºC | ||
| Adhesive spot diameter growth in curing | SJ/T 11187-1998 | < 10% | ||
| thermal expansion coefficient | α1 | TMA | 60×10 -6 K -1 | |
| α2 | 120×10 -6 K -1 | |||
| Volume resistance | 25ºC | 2.2×1015 Ω·cm | ||
| Surface resistance | 25ºC | 2.2×1015 Ω | ||
| Dielectric strength | 25ºC | 25 KV/mm | ||
| Dielectric constant | 25ºC, 1MHz | 3.2 | ||
| Dielectric loss angle tangent | 25ºC, 1MHz | < 0.02 | ||
Curing conditions
Absent the presence of special instructions, the curing condition will be 150 ºC for 30 min. The actual adhesive strength of red glue largely depends on the type of component, shape of the glue point, and the curing degree of the glue.
- With the one-off syringe packing type, it can be used on normal dot dispensers.
- The red glue should be preserved in a refrigerator maintain quality. Before processing, it should be taken out from the refrigerator and placed down vertically for de-freezing in room temperature (ideal temperature for 20~25ºC) about 2~4 hours until it reaching the room temperature. Hot water, oven, hot plate, heat gun and other heat sources should not be used to speed up de-freezing. This step is extremely important for obtaining optimal dot dispensing performance.
- There might be a few interspaces between the needle and its protective cover, which is a normal phenomenon during production. Before use, take the protective cover down and squeeze out a small amount of glue manually to empty the air in the front end.
- To avoid cross contamination of glues, the dot dispenser must be cleaned before equipping it with a syringe.
- The amount of dot dispensing depends on pressure, time, needle diameter and glue temperature. The above parameters should be gradually optimized according to the actual situation.
- Before curing, it can be cleaned by isopropyl alcohol solvent, acetone solvent, butanone solvent and esters solvent. After curing, it can be cleaned only by heating and mechanical removal.
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