Sn96.5AG3.0cu0.5 Sac305 Lead Free Silver Solder Paste (Syringe Packing and Bottle Packing)
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| Customization: | Available |
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| Type: | Flux-cored Wire |
| Material: | Copper / Copper Alloy |
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Basic Info.
- Model NO.
- Sn96.5Ag3.0Cu0.5 SAC305
- Flux Containing
- Containing Flux
- Slag Characteristic
- Acidic
- Extended Length
- >20mm
- Appearance
- Lucent, No Dirt on Surface
- Gross Weight of Solder Wire
- 500g/Roll
- Dimension of Solder Bar
- 35cm×28cm×24cm×0.7kg/PC
- Melting Point
- 138℃
- Flux Content
- 11-12%
- Stencil Life
- 12 Hours
- Halide Content
- <500ppm
- Customized Support
- OEM
- Transport Package
- Carton
- Specification
- Sn5/Pb92.5/Ag2.5
- Trademark
- OEM&ODM
- Origin
- China
Packaging & Delivery
- Package Size
- 35.00cm * 28.00cm * 24.00cm
- Package Gross Weight
- 0.500kg
Product Description
Sn96.5Ag3.0Cu0.5 SAC305 Solder Paste (Syringe Packing and Bottle Packing)
Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.
The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product.
Storage, Operation and Storage Life
- We suggest that the Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste should be kept in cold storage at the temperature range from 2 degrees Celsius to 8 degrees Celsius. The warranty period is 6 months from the date of production. Our goods ought to follow the First in First out principle.
- Before being used, the solder paste needs to be kept at a room temperature. The recommended time is 4 hours. After the recovery of room temperature, the storage life is 48 hours. After the product is unsealed, the storage life is 12 hours. It takes 100±20 minutes to make the solder paste stay on the printed circuit board before the reflow soldering process begins.
Chemical Component Data Sheet
| Type | Chemical Composition (wt. %) | |||||||
| Sn | Pb | Sb | Cu | Ag | Fe | Al | Cd | |
| Sn96.5Ag0.3Cu0.5 | Bal | < 0.1 | < 0.1 | 0.5±0.2 | 3.0±0.2 | < 0.02 | < 0.001 | < 0.002 |
| Type | Melting Point, ºC | Specific Gravity, g/cm3 | Tensile Strength, MPa |
| Sn96.5-Ag3.0-Cu0.5 | 217-219 | 7.40 | 53.3 |
| Specification | Sn99-Ag3.0-Cu0.5 |
| Appearance | Adhesive paste in grayish black |
| Weight | 500g/bottle, 10kg/box |
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