| Customization: | Available |
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| Type: | Flux-cored Wire |
| Material: | Copper / Copper Alloy |
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Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.
The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product.
Storage, Operation and Storage Life
Chemical Component Data Sheet
| Type | Chemical Composition (wt. %) | |||||||
| Sn | Pb | Sb | Cu | Ag | Fe | Al | Cd | |
| Sn96.5Ag0.3Cu0.5 | Bal | < 0.1 | < 0.1 | 0.5±0.2 | 3.0±0.2 | < 0.02 | < 0.001 | < 0.002 |
| Type | Melting Point, ºC | Specific Gravity, g/cm3 | Tensile Strength, MPa |
| Sn96.5-Ag3.0-Cu0.5 | 217-219 | 7.40 | 53.3 |
| Specification | Sn99-Ag3.0-Cu0.5 |
| Appearance | Adhesive paste in grayish black |
| Weight | 500g/bottle, 10kg/box |
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