Sn62.8pb36.8AG0.4 Middle Temperature Solder Paste Lead-Free Solder Paste Low Temperature Patch Printing Solder Paste Assembly Weldingmelting Point
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| Customization: | Available |
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| Type: | Flux-cored Wire |
| Material: | Copper / Copper Alloy |
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Basic Info.
- Model NO.
- Sn62.8Pb36.8Ag0.4
- Flux Containing
- Containing Flux
- Slag Characteristic
- Acidic
- Extended Length
- >20mm
- Appearance
- Lucent, No Dirt on Surface
- Gross Weight of Solder Wire
- 500g/Roll
- Dimension of Solder Bar
- 35cm×28cm×24cm×0.7kg/PC
- Transport Package
- Carton
- Specification
- Sn62.8Pb36.8Ag0.4
- Trademark
- OEM&ODM
- Origin
- China
Product Description
Sn62.8Pb36.8Ag0.4 Solder Paste (Syringe Packing and Bottle Packing) SMT
The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made up of 62.8% tin, 36.8% lead, and 0.4% silver content.
This kind of solder paste is a no-clean type solder cream designed for SMT production processes. It is made from special flux and tin spherical powder with few oxide contents. The paste maintains its viscosity allowing for a high level continuous printing effect. In addition, the flux contained in our Sn62.8Pb36.8Ag0.4 solder paste takes advantages of the high reliable low-ion type halogen activator. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.
Features- With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components, the separation distance of which can be only 0.2mm.
- There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 12 hours of operation of the steel mesh.
- The original shape will not be changed after several hours of printing. In addition, the surface mount assembly will not be affected.
- Favorable wetting property on the substrate made from different materials.
- It can adapt to the requirements of multiple grades of welding equipment. It operates well without a nitrogen-filled environment or in a wide furnace temperature range for reflow soldering.
- Excellent welding performance during "heating then preservation" and "gradually heating" furnace settings.
- There is a special designed solder paste for BGA chip carrier, which can solve the problem of BGA welding.
- Good ICT test performance.
- It can be used for paste in hole processes.
Alloy composition
| Composition | Content % |
| Sn % | 62.8±0.5 |
| Ag % | 0.4±0.1 |
| Pb % | Remainder |
| Cu % | ≤0.005 |
| Bi % | ≤0.03 |
| Fe % | ≤0.02 |
| As % | ≤0.01 |
| Ag % | ≤0.05 |
| Zn % | ≤0.002 |
| Al % | ≤0.001 |
| Pb % | ≤0.05 |
| Cd % | ≤0.002 |
| Sb % | ≤0.002 |
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