Sn62.8pb36.8AG0.4 Middle Temperature Solder Paste Lead-Free Solder Paste Low Temperature Patch Printing Solder Paste Assembly Weldingmelting Point

• Type: Flux-cored Wire
• Material: Copper / Copper Alloy
• Flux Containing: Containing Flux
• Slag Characteristic: Acidic
• Extended Length: >20mm
• Appearance: Lucent, No Dirt on Surface
• Model NO.: Sn62.8Pb36.8Ag0.4
• Gross Weight of Solder Wire: 500g/Roll
• Dimension of Solder Bar: 35cm×28cm×24cm×0.7kg/PC
• Transport Package: Carton
• Specification: Sn62.8Pb36.8Ag0.4
• Trademark: OEM&ODM
• Origin: China

Product Description

Sn62.8Pb36.8Ag0.4  Solder Paste (Syringe Packing and Bottle Packing) SMT

The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made up of 62.8% tin, 36.8% lead, and 0.4% silver content.

This kind of solder paste is a no-clean type solder cream designed for SMT production processes. It is made from special flux and tin spherical powder with few oxide contents. The paste maintains its viscosity allowing for a high level continuous printing effect. In addition, the flux contained in our Sn62.8Pb36.8Ag0.4 solder paste takes advantages of the high reliable low-ion type halogen activator. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.

Features

• With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components, the separation distance of which can be only 0.2mm.
• There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 12 hours of operation of the steel mesh.
• The original shape will not be changed after several hours of printing. In addition, the surface mount assembly will not be affected.
• Favorable wetting property on the substrate made from different materials.
• It can adapt to the requirements of multiple grades of welding equipment. It operates well without a nitrogen-filled environment or in a wide furnace temperature range for reflow soldering.
• Excellent welding performance during "heating then preservation" and "gradually heating" furnace settings.
• There is a special designed solder paste for BGA chip carrier, which can solve the problem of BGA welding.
• Good ICT test performance.
• It can be used for paste in hole processes.

 

 Features of tin alloy powder
Alloy composition

Composition	Content %
Sn %	62.8±0.5
Ag %	0.4±0.1
Pb %	Remainder
Cu %	≤0.005
Bi %	≤0.03
Fe %	≤0.02
As %	≤0.01
Ag %	≤0.05
Zn %	≤0.002
Al %	≤0.001
Pb %	≤0.05
Cd %	≤0.002
Sb %	≤0.002

 

 

 

 

Detailed Photos

Company Profile

Established in 2006, Kinggui Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. Our products are widely applied in the soldering of electronic components. Our company has obtained both ISO9001:2000 and ISO9001:2008 certificates. Plenty of our eco-friendly products have passed SGS, RoHS, and other certification.
 

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