| Customization: | Available |
|---|---|
| Type: | Flux-cored Wire |
| Material: | Copper / Copper Alloy |
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The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made up of 62.8% tin, 36.8% lead, and 0.4% silver content.
This kind of solder paste is a no-clean type solder cream designed for SMT production processes. It is made from special flux and tin spherical powder with few oxide contents. The paste maintains its viscosity allowing for a high level continuous printing effect. In addition, the flux contained in our Sn62.8Pb36.8Ag0.4 solder paste takes advantages of the high reliable low-ion type halogen activator. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.
Features| Composition | Content % |
| Sn % | 62.8±0.5 |
| Ag % | 0.4±0.1 |
| Pb % | Remainder |
| Cu % | ≤0.005 |
| Bi % | ≤0.03 |
| Fe % | ≤0.02 |
| As % | ≤0.01 |
| Ag % | ≤0.05 |
| Zn % | ≤0.002 |
| Al % | ≤0.001 |
| Pb % | ≤0.05 |
| Cd % | ≤0.002 |
| Sb % | ≤0.002 |
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