Sn42Bi58 Solder Paste (Syringe Packing and Bottle Packing) SMT
The Sn42Bi58 is a common lead free solder paste with an alloy composed of 42% tin and 58% bismuth. It has a preheat temperature from 90ºC to 110ºC, melting point of 138ºC, and the reflow temperature range from 150ºC to 100ºC. It is suitable for the demanding reflow-soldering process.
The activated flux in this product delivers superior fluxing effects. The solder paste was developed for soldering electrical devices at low temperatures. With good wetting properties and soldering performance, it is commonly used for soldering LED circuit boards.
This type of product has passed SGS tests and also holds numerous certifications, such as RoHS and REACH. It is also accompanied with the related material safety data sheet and abrasives as MSDS. The Sn42Bi58 Low temperature solder paste has been exported to such countries as Pakistan, Iran, Colombia, Italy, Spain, Ukraine, Mexico, etc. What's more, we are seeking agents on a global scale. Please don't hesitate to contact us if you are interested in our products.
Application
- Ideal for use in PCB, SMT, plug-in components, computer motherboards, phone motherboards, LED circuit boards, diversified lighting fixtures, as well as all sorts of high-precision circuit boards.
- Optimal choice for repairing small electronic equipment.
- Suitable for lead-free hot tin dipping and the soldering of various components.
- Can be used for multiple special soldering techniques.
- Jufeng Solder can customize lead-free solder paste according to your actual production conditions.
Features
- With nice fluidity and good soldering effect, the solder paste can accomplish the exquisite printing of circuit components, the separation distance of which can be only 0.3mm.
- There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 8 hours of operation of the steel mesh.
- The original shape will not be changed after several hours of printing process. In addition, the surface mount assembly will not be affected.
- Favorable wetting property on the substrate made from different materials. Thanks to good soldering performance, it performs well on all kinds of coating surfaces.
- With excellent fine pitch printing capability, it can successfully operate reflow soldering in air or in helium. It features high reliability, even if it is not cleaned after the reflow soldering process.
- Made of lead-free alloy with little oxidation and activated flux, its viscosity suits printing and dispensing processes.
- Through special flux, the solder paste has minimal residue with light color after soldering.
Technical data sheet
| Specification |
Sn42Bi58 |
| Appearance |
Adhesive paste in grayish black |
| Weight |
500g/bottle, 10kg/box |
Chemistry component
| Type |
Chemical composition (wt.%) |
| Sn |
Bi |
Sb |
Pb |
Fe |
Al |
Cd |
| Sn42-Bi58 |
42±0.5 |
58±0.5 |
< 0.02 |
< 0.01 |
< 0.02 |
< 0.002 |
< 0.003 |
Physical Speciality
| Type |
Melting Point(ºC) |
Spec. Gravity (g/cm3) |
Tensile Strength (Mpa) |
| Sn42-Bi58 |
138ºC |
8.6g/cm3 |
22HB |
Standard Paste Composition
| Application |
Type |
Diameter |
Content |
| Standard printing |
Alloy powder 3 |
25~45 μm |
89 % |
| Fine pitch printing |
Alloy powder 4 |
20~38 μm |
88.5 % |
| Instill |
Alloy powder 3 |
25~45 μm |
85 % |
Recommended process parameters
| Temperature rise speed |
The time taken to get to 110 ºC |
Constant temperature of 110 - 138 ºC |
Peak temperature |
> 138ºC |
Cooling speed |
| 1-3 ºC/sec |
< 60-90 sec |
60-100 sec |
175±5 ºC |
< 30-60 sec |
< 4 ºC/sec |
Company Profile
Established in 2006, Kinggui Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. Our products are widely applied in the soldering of electronic components. Our company has obtained both ISO9001:2000 and ISO9001:2008 certificates. Plenty of our eco-friendly products have passed SGS, RoHS, and other certification.
Packaging & Shipping
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