Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%

Product Details
Customization: Available
Type: Flux-cored Wire
Material: Tin
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  • Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
  • Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
  • Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
  • Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
  • Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
  • Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
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  • Company Profile
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
63/37
Flux Containing
Containing Flux
Slag Characteristic
Alkaline
Extended Length
10-20mm
Appearance
Lucent, No Dirt on Surface
Gross Weight of Solder Wire
500g/Roll
Flux Content
11-12%
Stencil Life
12 Hours
Halide Content
<500ppm
Customized Support
OEM
Single Package Size
6.5X6.5X7.5 Cm
Transport Package
Carton
Specification
Sn5/Pb92.5/Ag2.5
Trademark
OEM&ODM
Origin
China

Packaging & Delivery

Package Size
6.50cm * 6.50cm * 7.50cm
Package Gross Weight
1.000kg

Product Description

Applicable: paper that can't withstand high temperature or has special welding requirements for temperature resistance!It can meet SMT production of process products with special welding requirements for temperature resistance, LED patch Features: Environment-friendly and lead-free, 138 C melting point is low enough. Weight: 250g/500g 

Granules: 25-45um (No.3 powder)

lead-free high temperature, melting point 217 degrees. Applicable to high temperature resistant double-sided glass fiber PCB board. Features: environmental protection, lead-free, high melting point of 217 degrees. Weight: 50g/100g/200g/500g Sn99Ag0.3Cu0.7 Granules: 25-45um (No.3 powder)
 
degrees Lead-free, less tin. Full solder joints, easy printing and good expansibility. Composition: Sn64Bi35Agi Granules: 25-45um (No.3 powder) Weight: 200g/500g
 
 Environment-friendly lead-free soldering 305 high-temperature solder paste One kilogram of solder paste contains 30 grams of silver. One bottle of solder paste is 500g, that is, one bottle of solder paste contains 15g of silver. Wide application, high/middle/low end welding (Sn96.5Ag3Cu0.5) Melting point: 217 degrees Enhanced electrical conductivity, strong welding ability, welding light Granules: 20-38um (No.4 powder)
 
 

Chemical Component Data Sheet

Type Chemical Composition (wt. %)
Sn Pb Sb Cu Ag Fe Al Cd
Sn96.5Ag0.3Cu0.5 Bal < 0.1 < 0.1 0.5±0.2 3.0±0.2 < 0.02 < 0.001 < 0.002
Physical Properties
Type Melting Point, ºC Specific Gravity, g/cm3 Tensile Strength, MPa
Sn96.5-Ag3.0-Cu0.5 217-219 7.40 53.3
Main Specifications
Specification Sn99-Ag3.0-Cu0.5
Appearance Adhesive paste in grayish black
Weight 500g/bottle, 10kg/box
 
 
 

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Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%

Company Profile
Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
Established in 2006, Kinggui Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. Our products are widely applied in the soldering of electronic components. Our company has obtained both ISO9001:2000 and ISO9001:2008 certificates. Plenty of our eco-friendly products have passed SGS, RoHS, and other certification.
 
Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
 
Packaging & Shipping

 

Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%Suitable BGA/IC/PCB/LED/SMT 500g Rosin Core Solder Paste Sn42% Bi58%
 

 

 

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