Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)

Product Details
Customization: Available
Type: Flux-cored Wire
Material: Copper / Copper Alloy
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  • Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)
  • Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)
  • Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)
  • Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)
  • Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)
  • Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)
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  • Overview
  • Detailed Photos
  • Company Profile
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
Sn5/Pb92.5/Ag2.5
Flux Containing
Containing Flux
Slag Characteristic
Acidic
Extended Length
>20mm
Appearance
Lucent, No Dirt on Surface
Gross Weight of Solder Wire
500g/Roll
Dimension of Solder Bar
35cm×28cm×24cm×0.7kg/PC
Flux Content
11-12%
Stencil Life
12 Hours
Halide Content
<500ppm
Customized Support
OEM
Transport Package
Carton
Specification
Sn5/Pb92.5/Ag2.5
Trademark
OEM&ODM
Origin
China

Packaging & Delivery

Package Size
35.00cm * 28.00cm * 24.00cm
Package Gross Weight
1.000kg

Product Description

Sn5/Pb92.5/Ag2.5  Solder Paste (Syringe Packing and Bottle Packing)

 solder paste is made of high-reliability soldering flux and high-quality Sn5/Pb92.5/Ag2.5 alloy powder with high sphericity, uniform particle distribution, and low oxide content.

The high-reliability soldering flux of this solder paste is compounded of polymer film forming agent, modified resin, organic activator and polymer alcohol ether solvent. Besides, High lead, high melting point alloys that comply with RoHS exemption regulations are used.

Our high-lead solder paste usually applies to power semiconductor and other components packaging and welding. The alloy has good compatibility with gold, copper and silver with high welding strength and residual impedance. This solder paste features good printing fluidity and good solderability, less residual after welding, and high insulation resistance.

 
Features
  • Excellent wetting performance, suitable for different metal plating of solder pad
  • Great voiding performance
  • Easy to clean residue system
  • Excellent operation stability

Application

 solder paste meets the requirements of automatic dispensing process, can be used for high-temperature working devices, high-density integrated circuit packaging and welding of circuit boards requiring 2nd reflow. For example, it has good application effects in the fields of hybrid integrated circuits, semiconductor integrated circuits, filter devices, microwave devices, high-power devices, connectors, sensors, metal or ceramic enclosures of photoelectric devices and other special electronic components such as metal enclosures or ceramic enclosures.

 

 
 
 
Main Specifications
No Clean Lead-Free Solder Melting Point, °C Tensile Strength Elongation Rate, % Expansion Rate, % Particle Size, um Application Solder Wire Alloy Solder Bar Alloy Solder Paste Alloy Solder Powder Alloy
Sn63Pb37 183   45 70 25~75 Printed Circuit Board, PCB yes yes yes yes
Sn96.5Ag3.5 222 38 54 75 25~75 SMT yes yes yes yes
Sn96.5Ag3.0Cu0.5 217 40 58 78 25~75 SMD, SMT

LED circuit board, PCB board
yes yes yes yes
 
Sn99.0Ag0.3Cu0.7
Sn64Bi35Ag1 189 40 50 70 25~75 SMT, PCB no no yes yes
Sn62Pb36Ag2 189 38 54 75 25~75 SMT, PCB no no yes yes
Sn42Bi58 138 38 50 75 25~75 LED yes no yes yes
 
Detailed Photos

Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)

Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)

Company Profile
Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)
Established in 2006, Kinggui Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. Our products are widely applied in the soldering of electronic components. Our company has obtained both ISO9001:2000 and ISO9001:2008 certificates. Plenty of our eco-friendly products have passed SGS, RoHS, and other certification.
 
 
Packaging & Shipping

 

Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)Sn5/Pb92.5/AG2.5 High-Lead Solder Paste (Bottle Packing)
 

 

 

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