Sn96.5AG3.0cu0.5 Flux-Cored Lead Free Solder Wire and Solder Bar
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| Customization: | Available |
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| Type: | Flux-cored Wire |
| Material: | Copper / Copper Alloy |
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Basic Info.
- Model NO.
- Sn96.5Ag3.0Cu0.5
- Flux Containing
- Containing Flux
- Slag Characteristic
- Acidic
- Extended Length
- >20mm
- Appearance
- Lucent, No Dirt on Surface
- Gross Weight of Solder Wire
- 500g/Roll
- Dimension of Solder Bar
- 32cm×1.8cm×1.5cm×0.7kg/PC
- Transport Package
- Carton
- Specification
- Sn96.5-Ag3.0-Cu0.5
- Trademark
- OEM&ODM
- Origin
- China
Product Description
Sn96.5Ag3.0Cu0.5 Flux-cored Lead Free Solder Wire and Solder Bar
Our Sn96.5Ag3.0Cu0.5 flux-cored solder wire and solder bar is a commonly used product by adoption of lead-free soldering technique. It features relatively high cost, but bright solder joints and outstanding performance. Our company has achieved both SGS certificate and RoHS certificate for this type product.
The lead content of our solder wire and solder bar is generally less than 100ppm. This product is composed of 96.5% tin, 3% silver, and 0.5% copper. The diameter of the wire reaches over 0.1mm. Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.
Scope of Application
The Sn96.5Ag3.0Cu0.5 solder wire can be used for the soldering of the precise computer chips, mobile phone chips, stainless steel products, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.
- Favorable Fatigue Resistance and Solderability
There is a no-clean activated rosin flux inside the tin wire, which allows our product to provide distinguished soldering effect. - High Electrical Resistivity and Electrical Conductivity
Owing to the addition of copper, this Sn96.5Ag3.0Cu0.5 solder wire allows the electronic components to produce relatively high electrical resistivity during the soldering process. - Ultra High Resistance to Both Oxidation and Creep Deformation
The combination of three different alloy components provides this lead-free and eco-friendly tin wire with high melting point. Additionally, our product is difficult to be softened. Its antioxidant capacity is greatly enhanced. - Wonderful Soldering Effect, Fast Soldering Speed, Nice Wetting Property, and Good Fluidness
The activated flux in this product can offer superior fluxing effect.
| Specification | Sn96.5-Ag3.0-Cu0.5 | |||||||||
| Appearance | Lucent, no dirt on surface | |||||||||
| Gross Weight of Solder Wire | 500g/roll | |||||||||
| Dimension of Solder Bar (L×W×T×W) | 32cm×1.8cm×1.5cm×0.7kg/pc | |||||||||
| Weight of Solder Bar | 20kg/ctn. | |||||||||
| Chemical Components | ||||||||||
| Sn | Ag | Cu | Pb | Sb | Bi | Zn | Fe | Al | As | Cd |
| Residue Content | 3.0±0.2 | 0.5±0.2 | < 0.1 | < 0.1 | < 0.1 | < 0.001 | < 0.02 | < 0.001 | < 0.03 | < 0.002 |
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