| Type: | Flux-cored Wire |
|---|---|
| Material: | Copper / Copper Alloy |
| Flux Containing: | Containing Flux |
| Slag Characteristic: | Acidic |
| Extended Length: | >20mm |
| Appearance: | Lucent, No Dirt on Surface |
| Samples: |
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| Customization: |
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Suppliers with verified business licenses
Audited Supplier Our Sn99Ag0.3Cu0.7 lead free solder wire and solder bar is also known as SAC0307 lead-free solder with high melting point. Its composition is 99% tin, 0.3% silver, and 0.7% copper. Its lead content is usually lower than 100ppm on basis of customer needs.
The flux is used as the core of this lead-free solder wire produced by Kinggui Solder Company. Its dosage is normally 2%. The wire diameter can reach over 0.15mm. The material selection process strictly conforms to both RoHS Directive and SS-00259 standards. Moreover, our product is manufactured by adoption of a high standard of technological process from the raw material smelting, mixing, inspection, to perfusion.
Our environmentally-friendly lead free solder adopts two different raw materials, including the electrolytic lead with 99.99% refined-lead content, as well as the No.1 tin with its purity of over 99.97%. So far, our lead-free solder bar has been exported to such countries as Poland,Argentina, Peru, Pakistan,Italy, and more. In addition, we are seeking agents on a global scale. Please don't hesitate to contact us, if you are interested in our product.
Applications
The Sn99Ag0.3Cu0.7 solder wire is applicable for precise LED and mobile phone chips. The Sn99Ag0.3Cu0.7 solder bar is ideal for use in the hi-tech wave soldering machines as well as the small-sized tin furnaces. Moreover, our product can be applied in the printed circuit board (PCB) and the stainless steel products.
| Specification | Sn99-Ag0.3-Cu0.7 | |||||||||
| Appearance | Lucent, no dirt on surface | |||||||||
| Packing | G.W.: 500g/roll, 10kg/ctn. | |||||||||
| Chemical Components | ||||||||||
| Sn | Ag | Cu | Pb | Sb | Bi | Zn | Fe | Al | As | Cd |
| Residue Content | 0.3±0.1 | 0.7±0.2 | < 0.1 | < 0.1 | < 0.06 | < 0.001 | < 0.02 | < 0.001 | < 0.03 | < 0.002 |
| Alloy Component | Melting Point, ºC | Tensile Strength, g/cm3 | Rigidity HB | Heat Conductivity M.S.K | Tensile Strength, MPa | Elongation Rate, % | Electric Conductivity, % |
| Sn99Ag0.3Cu0.7 | 230 | 7.4 | 9 | 64 | 32 | 48 | 16.0 |
Suppliers with verified business licenses
Audited Supplier 
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