Snbiag Lead Free 63/37 3# Solder Paste

• Type: Flux-cored Wire
• Material: Tin
• Flux Containing: Containing Flux
• Model NO.: 63/37
• Slag Characteristic: Alkaline
• Extended Length: 10-20mm
• Appearance: Lucent, No Dirt on Surface
• Gross Weight of Solder Wire: 500g/Roll
• Flux Content: 11-12%
• Stencil Life: 12 Hours
• Halide Content: <500ppm
• Customized Support: OEM
• Single Package Size: 6.5X6.5X7.5 Cm
• Transport Package: Carton
• Specification: Sn5/Pb92.5/Ag2.5
• Trademark: OEM&ODM
• Origin: China

Product Description

Applicable: paper that can't withstand high temperature or has special welding requirements for temperature resistance!It can meet SMT production of process products with special welding requirements for temperature resistance, LED patch Features: Environment-friendly and lead-free, 138 C melting point is low enough. Weight: 250g/500g 

Granules: 25-45um (No.3 powder)

lead-free high temperature, melting point 217 degrees. Applicable to high temperature resistant double-sided glass fiber PCB board. Features: environmental protection, lead-free, high melting point of 217 degrees. Weight: 50g/100g/200g/500g Sn99Ag0.3Cu0.7 Granules: 25-45um (No.3 powder)

 

degrees Lead-free, less tin. Full solder joints, easy printing and good expansibility. Composition: Sn64Bi35Agi Granules: 25-45um (No.3 powder) Weight: 200g/500g

 

 Environment-friendly lead-free soldering 305 high-temperature solder paste One kilogram of solder paste contains 30 grams of silver. One bottle of solder paste is 500g, that is, one bottle of solder paste contains 15g of silver. Wide application, high/middle/low end welding (Sn96.5Ag3Cu0.5) Melting point: 217 degrees Enhanced electrical conductivity, strong welding ability, welding light Granules: 20-38um (No.4 powder)

 

 

Chemical Component Data Sheet

Type	Chemical Composition (wt. %)
	Sn	Pb	Sb	Cu	Ag	Fe	Al	Cd
Sn96.5Ag0.3Cu0.5	Bal	< 0.1	< 0.1	0.5±0.2	3.0±0.2	< 0.02	< 0.001	< 0.002

Physical Properties

Type	Melting Point, ºC	Specific Gravity, g/cm^3	Tensile Strength, MPa
Sn96.5-Ag3.0-Cu0.5	217-219	7.40	53.3

Main Specifications

Specification	Sn99-Ag3.0-Cu0.5
Appearance	Adhesive paste in grayish black
Weight	500g/bottle, 10kg/box

 

 

 

Company Profile

Established in 2006, Kinggui Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. Our products are widely applied in the soldering of electronic components. Our company has obtained both ISO9001:2000 and ISO9001:2008 certificates. Plenty of our eco-friendly products have passed SGS, RoHS, and other certification.
 

 

Packaging & Shipping