Customization: | Available |
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Type: | Flux-cored Wire |
Material: | Copper / Copper Alloy |
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1.High heat-resistivity and excellent electric properties are possessed.
2.Usable for screen printing.
is a kind of single epoxy resin adhesive .Good stable curing shapes without stringing, overflowing and slumping are achieved even at a super high speed and long time printing. Because of the "rarely cutting" bonding strength and very low humidity absorption, it is specially fit for SMT technology of porous printing in common temperature. Its shape can easily be controlled .We can not only expect a long-term preservation stability but also the excellent thermal resistance and electrical properties.
Feature:
Item | Testing condition | Properties |
Composition | - | Epoxy resin |
Appearance | Visual inspection | Red color gel |
Homogeneity | 25ºC, fineness meter | < 100μm |
Gravity | 25ºC | 1.25 g/cm³ |
Viscosity | 25ºC, 5rpm | 450,000cps |
Trixtropy Index | 1rpm/10rpm | 6.7 |
Yield Value | 25ºC, Haak RV1 Cone plate rheometer, PK100,PK1/1o | 300~650Pa |
CASSON Viscosity | Same as above | 0.15~1.8PaS |
Application process | - | Screen printing, dispensing machine |
Recommended curing condition
The recommended curing condition is 90~120 sec after surface temperature has reached 150ºC, or 160~180 sec after surface temperature has reached 120ºC. The highest curing temperature should not exceed 200 ºC. The ideal curing condition depends on the curing furnace. With a higher curing temperature and longer curing time, the stronger the adhesive strength. The typical curing curve of red glue is as follows:
Item | Testing condition | Properties | ||
Adhesive property | Lap shear strength | 25ºC,steel - steel | >15MPa Mpa | |
Thrust | 25ºC, C1206-FR4 copper plate | >40 N | ||
Tg | TMA | 80ºC | ||
Adhesive spot diameter growth in curing | SJ/T 11187-1998 | < 10% | ||
thermal expansion coefficient | α1 | TMA | 60×10 -6 K -1 | |
α2 | 120×10 -6 K -1 | |||
Volume resistance | 25ºC | 2.2×1015 Ω·cm | ||
Surface resistance | 25ºC | 2.2×1015 Ω | ||
Dielectric strength | 25ºC | 25 KV/mm | ||
Dielectric constant | 25ºC, 1MHz | 3.2 | ||
Dielectric loss angle tangent | 25ºC, 1MHz | < 0.02 |
Curing conditions
Absent the presence of special instructions, the curing condition will be 150 ºC for 30 min. The actual adhesive strength of red glue largely depends on the type of component, shape of the glue point, and the curing degree of the glue.